Back to service catalogue
Heterogeninė integracija
Prototyping
Hybrid 3D Ceramic Printing
This service is delivered by KTU.
Heterogeneous Integration
Technical Scope and Capabilities
This service supports creation of complex ceramic structures using hybrid 3D printing/stereolithography system for advanced electronics packaging, including
- housings
- radiators
- micro-mechanical systems.
Core Infrastructure / Tools / Equipment
The service uses Ceram C101 Hybrid equipment, with 100 × 100 × 150 mm build platform size and 0.020 - 0.125 mm Z-axis movement. 3D printed items are sintered using Hobersal HCV56/12 and XG3/8 muffle furnaces.
Material selection
- ceramic-ceramic
- ceramic-metal
- ceramic-polymer.
Technical Parameters of UV laser
- laser power, 300 mW
- spot size, ≈ 60 µm
- wavelength, 405 nm.
Sintering capabilities
- volume, 56 l (HCV56/12) and 3 l (XG3/8)
- power, 12 kW (HCV56/12) and 4 kW (XG3/8)
- voltage, 380 V (HCV56/12) and 220 V (XG3/8)
- temperature, 1200 °C (HCV56/12) and 1800 °C (XG3/8)
- continuous temp., 1100 °C (HCV56/12) and 1700 °C (XG3/8).
Target Audience and Possible Clients
The service is intended for
- start-ups validating electronic packaging designs or developing advanced packaging solutions for bioelectric, photonic or electronic prototypes
- SMEs seeking a low cost electronic package manufacturing without the need to acquire related infrastructure
- academic institutions developing advanced electronic packages for various niche applications.
Service Delivery Mode
The service delivery modes are
- prototype packages for low-volume production and validation
- R&D collaboration in advanced packaging systems
- consulting regarding material selection, possible challenges and technical limitations.
Possible Restrictions
The service is limited to
- projects less than 100 × 100 × 150 mm in size
- operation in 20-25 °C temperature (maximum room temperature variantion 1 °C/hour)
- operation in humidity of 50% RH.