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Heterogeneous integration
Prototyping
Hybrid 3D Ceramic Printing
Heterogeneous Integration
Technical Scope and Capabilities
This service supports creation of complex ceramic structures using hybrid 3D printing/stereolithography system for advanced electronics packaging, including
- housings
- radiators
- micro-mechanical systems.
Core Infrastructure / Tools / Equipment
The service uses Ceram C101 Hybrid equipment, with 100 × 100 × 150 mm build platform size and 0.020 - 0.125 mm Z-axis movement. 3D printed items are sintered using Hobersal HCV56/12 and XG3/8 muffle furnaces.
Material selection
- ceramic-ceramic
- ceramic-metal
- ceramic-polymer.
Technical Parameters of UV laser
- laser power, 300 mW
- spot size, ≈ 60 µm
- wavelength, 405 nm.
Sintering capabilities
- volume, 56 l (HCV56/12) and 3 l (XG3/8)
- power, 12 kW (HCV56/12) and 4 kW (XG3/8)
- voltage, 380 V (HCV56/12) and 220 V (XG3/8)
- temperature, 1200 °C (HCV56/12) and 1800 °C (XG3/8)
- continuous temp., 1100 °C (HCV56/12) and 1700 °C (XG3/8).
Target Audience and Possible Clients
The service is intended for
- start-ups validating electronic packaging designs or developing advanced packaging solutions for bioelectric, photonic or electronic prototypes
- SMEs seeking a low cost electronic package manufacturing without the need to acquire related infrastructure
- academic institutions developing advanced electronic packages for various niche applications.
Service Delivery Mode
The service delivery modes are
- prototype packages for low-volume production and validation
- R&D collaboration in advanced packaging systems
- consulting regarding material selection, possible challenges and technical limitations.
Possible Restrictions
The service is limited to
- projects less than 100 × 100 × 150 mm in size
- operation in 20-25 °C temperature (maximum room temperature variantion 1 °C/hour)
- operation in humidity of 50% RH.