Lithuanian Chips Competence Center
A one-stop shop for advanced semiconductor technologies in Lithuania
What we offer
Everything a chip project needs, in one place
You submit one request; we assemble the right team and infrastructure. You never need to know which institution operates the equipment.
Services
Design, prototyping, testing and consultancy across the semiconductor product cycle.
Browse the catalogueInfrastructure & pilot lines
Clean rooms, deposition, lithography and laser processing in Lithuania, and a route to the European pilot lines.
See the facilitiesTraining
Semiconductor courses for engineers and companies, delivered with Lithuania's technical universities.
Browse coursesFunding & networking
Guidance on European and national funding, and introductions across the European ecosystem.
Get guidanceHow we work
Five steps from request to result
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Submit your request
Describe your technical need. It is registered and assigned to the relevant expert.
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Feasibility assessment
We review feasibility, expertise and infrastructure availability.
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Scope & agreement
Objective, timeline, price and confidentiality, agreed and signed.
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Delivery
Work at consortium laboratories, one point of contact throughout.
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Results & follow-up
Results and documentation, plus advice on next steps.
Service catalogue
Find the service your project needs
Filter by specialisation area or search by keyword. Every service opens a detail page with scope, equipment and contact information.
Semiconductor Design and Simulation Support through the ChipsC2-LT Access Node
This service supports users throughout the semiconductor design lifecycle, from concept definition and feasibility analysis to design, simulation, tape-out preparation and validation. The service operates in coordination with the EU Chips Design Platform, which provides access to electronic design automation tools, process design kits, IP libraries and fabrication pathways.
Technology and Tools Selection Consulting
This service supports the selection of suitable semiconductor technologies and design tools for specific product or system requirements. The assessment considers:
R&D Projects with Industry
This service supports joint research and experimental development projects with industry partners. It is directed towards the development of new products, technologies or functional prototypes.
ABC Modelling of Carrier Dynamics
This service provides ABC simulations based on carrier dynamics parameters. The simulations can provide information on recombination rates of individual radiative and non-radiative channels.
Integrated Circuit Design: ASIC, RFIC, MMIC, Analog, Digital and Power ICs
This service provides full-cycle integrated circuit design from technical specification to tape-out for fabrication. It covers analog, digital and mixed-signal solutions implemented using CMOS, GaN and SiC technologies.
RF and Microwave Circuit Design
This service provides RF and microwave circuit design, covering schematic development and physical layout optimisation.
Power Electronics Design
This service provides power electronics design using CMOS, GaN and SiC technologies. It supports development of:
Digital Circuit Synthesis and HDL Design
This service provides digital integrated circuit design and synthesis using VHDL and Verilog. It covers simple logic circuits as well as ASIC, FPGA and SoC solutions for industrial, communication and automation applications.
Computer-Aided Modelling of Integrated Circuits and RF Systems
This service provides modelling of integrated circuits and RF systems using industry-standard design and simulation platforms.
Electromagnetic Analysis for IC, RF and Microwave Systems
This service provides electromagnetic analysis to optimise integrated circuits, RF systems and microwave systems.
Layout Design and Verification
This service provides physical layout design for integrated circuits, considering technological and foundry requirements.
Tape-Out Management
This service supports the transition from IC design to manufacturing. It includes coordination of design data, layout files and documentation according to foundry specifications.
Test System Development
This service provides customised automated test equipment solutions for prototype ICs or modular systems.
Chip Testing
This service provides testing of bare wafers and packaged integrated circuits. Measurements are performed up to 26 GHz and evaluate electrical parameters and RF characteristics.
Failure Analysis of Integrated Circuits
This service determines root causes of non-functional or malfunctioning chips using electrical and RF testing methods.
System-Level Integration Consulting
This service supports integration of ICs into complex systems and final products. It includes analysis of:
Prototype System Development and Demonstration
This service supports the creation of demonstration prototypes and validation of technological solutions under real-world conditions.
Design Optimisation and Redesign
This service supports improvement of existing integrated circuits and systems. It includes:
Electrical Characterisation of Semiconductor Structures and Devices
This service provides I-V and C-V measurements of semiconductor structures and devices over the temperature range from -40 °C to 300 °C.
Carrier Drift Current Transient Profiling in Semiconductor Devices
This service provides profiling of carrier drift current transients and measurement of:
Defect Spectroscopy by Deep Level Transient Spectroscopy
This service provides defect spectroscopy in semiconductor structures and devices using deep level transient spectroscopy.
Contactless Defect, Recombination and Radiation-Damage Characterisation
This service group provides several contactless and photoelectric methods for semiconductor defect and recombination characterisation.
Response-Speed Measurements of Photodetectors and High-Voltage Switches
This service determines response speed of photodetectors and high-voltage switches using 10 ps pulsed excitations at 10 Hz repetition rate and 100 ps temporal resolution.
Wide Bandgap Semiconductors for High-Power and High-Frequency Applications
This service provides an integrated fabrication chain for prototyping active and passive microelectronic and plasmonic components on wide bandgap semiconductor platforms.
SMT Assembly and Serial Production Optimisation
This service supports optimization of prototypes for serial production within the Protolab Continental SMT centre at KTU.
Packaging – Substrate and Interposer Manufacturing: Circuit for Routing, Interconnections and Vias Manufacturing
This service provides advanced semiconductor packaging processes based on SSAIL, Surface-Selective Atomic Interface Layer, technology. It enables selective surface metallisation, redistribution layer formation and electrical interconnect fabrication on organic and inorganic dielectrics and semiconductors.
Manual Die Bonding
This service uses a Fineplacer PICO multi-purpose manual die bonder for high-accuracy assembly of semiconductor components.
Semi-Automatic Ultrasonic Wire Bonding
This service uses a semi-automatic thermosonic wire bonder to create electrical interconnects between semiconductor dies and packages or carriers.
High-Precision Positioning, Bonding and Advanced Packaging
This service supports physical realisation and integration of fabricated chips using high-precision positioning and bonding.
Chip-to-System Wire Bonding
This service provides automatic chip-to-system connectivity through thermosonic wire bonding for System in package (SiP) applications.
Hybrid 3D Ceramic Printing
This service supports creation of complex ceramic structures using hybrid 3D printing/stereolithography system for advanced electronics packaging, including:
Printed and Organic Electronics
This service enables production of thin-film prototypes featuring a materials deposition system capable of depositing of a wide variety of fluids including biological fluids, inorganic and organic conductives and photoresists.
Photoluminescence Spectroscopy
This service provides luminescence-related measurement and analysis using complementary luminescence spectroscopy setups.
Time-Resolved Spectroscopy in Picosecond Domain
This service measures small carrier diffusion coefficients of 0.001–0.1 cm²/s in double-side polished semiconductor materials.
Spatially Resolved Luminescence Measurement and Analysis
This service provides spatially resolved luminescence measurement and analysis using a confocal microscope.
Luminescence and Surface Morphology Measurement Using Scanning Near-Field Optical Microscopy
This service provides spatially resolved luminescence measurement and surface morphology analysis using scanning near-field optical microscopy. It supports simultaneous high-spatial-resolution optical imaging and surface morphology information.
Cathodoluminescence and Electron Microscopy Services
This service group provides electron microscopy, cathodoluminescence, EBIC, defect-density evaluation and data-analysis services.
Carrier Dynamics Characterisation in Wide and Narrow Bandgap Semiconductors
This service provides characterisation of non-equilibrium charge carrier dynamics in organic or inorganic, wide or narrow bandgap semiconductors.
Ultrafast Carrier Dynamics Characterisation
This service provides contactless, non-destructive characterisation of ultrafast photoinduced processes in semiconductor materials and devices. It is suitable for investigation of:
Carrier Diffusion and Lifetime Measurement
This service provides contactless, non-destructive characterisation of carrier diffusion, mobility, recombination and refractive-index dynamics in semiconductor materials. It is suitable for investigation of charge transport processes in semiconductor materials and devices.
UV-VIS-NIR Luminescence Measurements of Semiconductor Materials and Devices
This service measures:
Emission Decay Kinetics Measurements
This service provides time-resolved measurements of UV-VIS emission decay kinetics, including:
Quantum Yield Measurements
This service determines emission efficiency by measuring the ratio of absorbed to emitted photons in luminescent semiconductor materials.
Surface Morphology Measurement Using Atomic Force Microscopy
This service provides surface morphology measurement and analysis using atomic force microscopy. It supports investigation of:
End-to-End Optical Characterisation
This service combines:
High-Accuracy Alanine-Based Dosimetry
This service provides high-accuracy alanine-based dosimetry in the range from 1 Gy to 200 kGy.
Investigation of Sensors under Pulsed X-Ray Irradiation
This service provides characterisation of detectors and other devices exposed to short X-ray pulses of broad spectrum.
Molecular Beam Epitaxy Growth of Advanced III-V Semiconductor Heterostructures
This service provides atomic-level control of film growth under ultra-high-vacuum conditions. It is intended for production of complex heterostructures and quantum-scale architectures.
Prototyping of III-V Group Semiconductor Optoelectronic Devices
This service provides an end-to-end prototyping chain for active optoelectronic components based on III-V compound semiconductors. The examples listed are:
PIC Front-End Prototyping: Lithography and Precision Dry Etching
This service provides an integrated fabrication chain for prototyping active and passive photonic components on III-V or silicon-based platforms.
Femtosecond Laser Waveguide Fabrication and Glass Processing
This service provides an integrated fabrication and characterisation platform for photonic integrated circuits based on femtosecond laser processing in transparent materials, particularly glass substrates. It enables rapid prototyping of embedded optical waveguides and 3D photonic structures for telecom and sensing applications.
Monitoring System Development for Industrial Applications
This service provides investigation and development of monitoring or quality-control systems based on terahertz frequency technologies. Terahertz radiation can penetrate a range of non-conductive materials, including plastics, ceramics, textiles and composites, without causing damage. The service enables non-invasive inspection and real-time analysis of internal structures, defects and inconsistencies.
Photonic and MEMS System Development through Foundry Pathways
This service supports development of traditional semiconductors and specialised photonic and MEMS systems through design, prototyping and access to a network of foundry partners.
3D Printing according to Customer Drawings
This service provides 3D printing according to drawings provided by the customer.
Scientific Literature Review and Technology Landscape Analysis
This service provides structured scientific literature reviews and technology landscape analyses for SMEs, start-ups and research entities developing semiconductor-related products or projects. The service draws on the combined scientific expertise of all four ChipsC²-LT consortium partners — FTMC, VU, VILNIUS TECH and KTU — across the full range of semiconductor technology domains covered by the centre.
Feasibility Studies for Semiconductor Products and Solutions
This service provides technological and engineering feasibility studies for new products or solutions. The service assesses whether a concept can be implemented using CMOS, GaN or SiC technologies.
Advanced Semiconductor, Photonic, MEMS and Heterogeneous System Prototyping
This service supports the transition from initial conceptual design to physical realisation of advanced semiconductor, photonic, MEMS and heterogeneous integrated systems. The service focuses on prototyping-oriented development activities that bridge research concepts with manufacturable demonstrators and pilot-scale implementations. The activities include advanced integrated circuit design, photonic integrated circuit development, MEMS device prototyping, heterogeneous integration of electronic
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