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Heterogeninė integracija
Prototyping
Semi-Automatic Ultrasonic Wire Bonding
Heterogeneous Integration
Technical Scope and Capabilities
This service uses a semi-automatic thermosonic wire bonder to create electrical interconnects between semiconductor dies and packages or carriers.
Core Infrastructure / Tools / Equipment
The service uses a TPT HB10 semi-automatic wire bonder with motorised Z-axis.
Bonding Modes
Supported bonding modes include:
- ball bonding
- wedge bonding
- bump bonding
- ribbon bonding.
Material Compatibility
Supported materials include:
- gold wire, 25 micrometres and 50 micrometres
- aluminium wire, 25 micrometres
- gold ribbon, 20 × 100 micrometres.
Process Control
Process parameters and features include:
- ultrasonic frequency of 63.3 kHz
- ultrasonic power of 10 W
- maximum bond force of 150 cN
- integrated heating stages of 60 mm diameter and 100 × 100 mm
- heating up to 250 °C
- automatic bond height adjustment
- live-camera monitoring for precision placement.
Target Audience and Possible Clients
The service is intended for
- start-ups validating interconnection strategies for photonic or electronic prototypes
- SMEs requiring pilot-scale assembly of 2.5D or 3D integration structures for e-mobility or communication sectors
- academic institutions researching advanced packaging and high-frequency device integration.
Service Delivery Mode
The service delivery modes are
- rapid prototyping from fabricated dies to functional electrically connected modules
- pilot-scale assembly for low-volume production runs and feasibility testing of hybrid integration
- training for industry engineers on equipment operation.
Service Delivery Terms and Times
A mandatory technology testing plan is developed for each client, explicitly defining the scope, timing and technical milestones of the prototyping run.
Possible Restrictions
The facility is optimised for small-batch prototyping and is not equipped for high-volume automated mass production.