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Heterogeninė integracija
Prototyping
Packaging – Substrate and Interposer Manufacturing: Circuit for Routing, Interconnections and Vias Manufacturing
Heterogeneous Integration
Technical Scope and Capabilities
This service provides advanced semiconductor packaging processes based on SSAIL, Surface-Selective Atomic Interface Layer, technology. It enables selective surface metallisation, redistribution layer formation and electrical interconnect fabrication on organic and inorganic dielectrics and semiconductors.
Selective Surface Metallisation
The service supports
- area-selective metal deposition on predefined regions
- high-resolution patterning without full-surface metallisation
- reduced process steps compared with conventional lithography and plating.
Redistribution Layer Formation
The service supports
- fabrication of fine-pitch routing layers for signal redistribution
- multilayer RDL integration for advanced packaging architectures
- fan-in and fan-out wafer-level packaging.
Electrical Contact and Interconnect Formation
The service supports
- formation of reliable electrical contacts between device layers
- fine-pitch interconnects for high-density integration
- metallisation for pads, vias and routing structures.
Process Integration
The service supports
- compatibility with standard semiconductor process flows
- integration with dielectric layers and passivation schemes
- heterogeneous integration involving CMOS, MEMS and photonics.
Materials and Substrates
Supported materials and substrates include:
- silicon and compound semiconductor wafers
- dielectric materials, including SiO₂, polymers and passivation layers
- metal systems such as Cu, Ni and Au, depending on application.
Core Infrastructure / Tools / Equipment
The service uses
- 5-axis femtosecond laser processing system
- automated electroless metal deposition system with 15 tanks of 50 litres each.
Service Delivery Mode
The service delivery modes are
- small-batch prototyping
- technology consulting through one-to-one sessions to develop testing plans and assess technical feasibility
- training for industry engineers on equipment operation.
Service Delivery Terms and Times
A mandatory technology testing plan is developed for each client, explicitly defining the scope, timing and technical milestones of the prototyping run.
Possible Restrictions
Processing capacity is limited to wafers up to 8 inches in diameter.