Technical Parameters

Stencil printer IWT Accela:

• maximum substrate weight, 7kg
• total system alignment, ±12.5 µm
• wet print deposit, ±25 µm
• cycle time, less than 5.5 s
• maximum board size, 558 × 508 mm
• minimum board size, 50.8 × 50.8 mm
• board edge clearance, configurable to 3 mm or 5 mm
• transport height from floor, 813 - 1041 mm
• snap-off, -0.025 - 12.7 mm
• print Speed, 6 - 305 mm/s
• print Stroke, ±280 mm.

Pick & place machine NXT-1:

• PCB size, from 48 × 48 mm to 510 × 534 mm
• patch speed, H12HS – 22500; H08 – 10500; H04 - 6500; H01 - 4200
• patch accuracy, H12S/H08/H04: 0.05 mm (3 sigma) cpk ≥ 1.00
• patch range, H12S - ~7.5 × 7.5 mm high; H08 - ~12 × 12 mm high; H04 - ~38 × 38 mm high; H01/H02/OF - ~74 × 74 mm; G04 - ~15 × 15 mm high
• mounted rack, maximum of 20 species/module (8mm tape conversion)
• air flow rate, 0.5 MPa.

Reflow oven V8 Nitro 3.2 B:

• heating zone length, 3200 mm
• maximum permissible soldering temp., 300°C for preheating zones and 350°C for peak zones
• cooling zone length, 1000 mm (two-stage, water-cooled)
• conveyor system width (single), 50 - 400 mm
• conveyor speed, 180 - 1800 mm/min.
• width of a mesh belt conveyor, 400 mm
• clearance above the mesh belt conveyor, 30 mm.

Packaging, Substrate and Interposer Manufacturing