Wide Bandgap Semiconductors for High-Power and High-Frequency Applications
Power Electronics
Technical Scope and Capabilities
This service provides an integrated fabrication chain for prototyping active and passive microelectronic and plasmonic components on wide bandgap semiconductor platforms.
The supported material platforms include
- GaN
- AlGaN
- InAlGaN
- GaO
- AlGaO.
Patterning
The service uses a SUSS MA/BA6 Gen4 mask aligner for UV photolithography. The system provides resolution down to 1 micrometre for fabrication of microstructures on substrates from 5 × 5 mm² up to full 100 mm, or 4-inch, wafers.
Mesa Formation
Mesa formation is supported by:
- Oxford PlasmaPro 100 Cobra ICP-RIE for high-precision anisotropic etching of III-V and wide bandgap materials with laser endpoint detection
- TANDENTRON 4110A ion accelerator for modification of electrical, optical, magnetic or mechanical properties without altering the overall sample composition.
Ohmic Contact Formation
Ohmic contacts are formed using:
- VST Model TFDS-870 electron-beam evaporation for Ti, Al, Ni and Au layers
- UniTemp-RTP-1300 rapid thermal process oven
- UniTemp RTP-100-HV high-vacuum compliant rapid thermal process oven.
Schottky Contact Formation
Schottky contact formation uses VST Model TFDS-870 electron-beam evaporation for deposition of Ni, Pt and Pd layers.
Device Passivation
Device passivation is performed using Oxford PlasmaPro 80 PECVD for SiO₂ and Si₃N₄ passivation layers.
Wire Bonding
Wire bonding is supported by a TPT HB10 semi-automatic wire bonder with motorised Z-axis for Au or Al wire bonding.
Infrastructure
Processes are performed in integrated cleanroom zones meeting ISO 5 for lithography and ISO 7 for etching.
Target Audience and Possible Clients
The service is designed as a first entry point for users requiring rapid prototyping of advanced semiconductor solutions. Possible clients include
- start-ups validating photonic designs from laboratory to prototype phase
- SMEs seeking to innovate without high upfront infrastructure costs
- academic institutions requiring high-precision fabrication for R&D projects or collaborative technological experiments.
Service Delivery Mode
The service delivery modes are
- small-batch prototyping for transition from design to physical prototype for low-volume production or validation
- training for industry engineers on fabrication equipment operation.
Service Delivery Terms and Times
A mandatory technology testing plan is developed for each client, explicitly defining the scope, timing and technical milestones of the prototyping run.
Possible Restrictions
The service is limited to small-batch prototyping and research. It is not intended for mass or high-volume manufacturing.