The European semiconductor sector is being rapidly strengthened through EU Chips Act initiatives aimed at increasing Europe’s technological sovereignty, fostering innovation, and building a modern semiconductor infrastructure. One of the most significant of these initiatives is the APECS Pilot Line, which provides researchers and industry representatives with access to advanced technologies across the entire semiconductor value chain — from chip design to chip packaging, testing, and characterisation. This enables not only fundamental research, but also the effective transfer of research results into applied applications.
Research Areas and Opportunities
The initiative focuses on heterogeneous integration, chiplet solutions, and complex electronic systems that are critical to artificial intelligence, telecommunications, and medical technologies.
APECS provides the opportunity to use state-of-the-art European research infrastructure, collaborate with international partners, and test technologies under real-world conditions. This is particularly important for achieving greater research impact and readiness for commercialisation.
Benefits for Participants
APECS offers the opportunity to:
- access modern European infrastructure without significant upfront investment
- gain access to expert knowledge and technological competencies
- develop joint projects with academic and industry partners
Call Schedule
Open access calls are planned annually for the period 2026–2029.
The first call opens on 1 April 2026 and closes on 30 June 2026.
Further information: https://www.apecs.eu/en/acess.html ir https://short-url.org/1lRjt
Lithuanian semiconductor industry companies and research institutions are invited to actively engage and take advantage of the opportunity to strengthen their technological competencies and expand their activities internationally. The Lithuanian Chips Competence Centre (ChipsC2 LT) provides consultations and supports Lithuanian semiconductor ecosystem participants in joining European pilot line activities.