Technical Scope and Capabilities

This service supports users throughout the semiconductor design lifecycle, from concept definition and feasibility analysis to design, simulation, tape-out preparation and validation. The service operates in coordination with the EU Chips Design Platform, which provides access to electronic design automation tools, process design kits, IP libraries and fabrication pathways.

The service supports users in

If the required expertise is not available at VILNIUS TECH, users are guided to an appropriate partner or resource within the EU Chips Design Platform.

• concept and technical challenge definition
• feasibility analysis and system-level definition
• access to design tools, PDKs and simulation environments through the EU Chips Design Platform and associated infrastructures such as Europractice
• design, modelling and verification
• MPW submission and fabrication coordination through platform channels
• post-silicon validation and testing.

Core Infrastructure / Tools / Equipment

The service uses and facilitates access to

• Cadence
• ADS
• TCAD
• Europractice
• EDA tools
• PDKs
• IP libraries
• RF/DC testing infrastructure up to 26 GHz.

Service Delivery Mode

The service is delivered through

• engineering support
• feasibility analysis
• design and modelling support
• platform-access guidance
• tape-out preparation support
• post-silicon validation support.

Expected Outputs

The stated outputs include

• schematics
• layouts
• simulation reports
• GDSII files
• tape-out packages
• measurement reports
• trained engineers.

Service Delivery Terms and Times

Design and testing activities are carried out under formally established Non-Disclosure Agreements. Where additional stakeholders are involved, such as chip design tool providers, technology platform operators or semiconductor manufacturers, tripartite or multi-party Non-Disclosure Agreements may be concluded.