Technical Scope and Capabilities

This service supports the transition from initial conceptual design to physical realisation of advanced semiconductor, photonic, MEMS and heterogeneous integrated systems. The service focuses on prototyping-oriented development activities that bridge research concepts with manufacturable demonstrators and pilot-scale implementations. The activities include advanced integrated circuit design, photonic integrated circuit development, MEMS device prototyping, heterogeneous integration of electronic, photonic and sensing components, adaptation of designs for specialised fabrication technologies, and preparation of demonstrators for validation and technology transfer. The service also supports multi-technology integration workflows and access to specialised European and international foundry ecosystems, enabling rapid prototyping, early-stage technology validation, manufacturability assessment and accelerated transition from research concepts towards functional and industrially relevant microsystem solutions.

Core Infrastructure / Tools / Equipment

The service uses

• Cadence software
• Siemens EDA software.

Expected Outputs

The service enables development of traditional semiconductors and specialised photonic and MEMS systems.