Prototyping of III-V Group Semiconductor Optoelectronic Devices
Photonic Integrated Circuits
Technical Scope and Capabilities
This service provides an end-to-end prototyping chain for active optoelectronic components based on III-V compound semiconductors. The examples listed are
- LEDs
- laser diodes
- THz detectors.
Advanced Epitaxial Growth
The service uses Veeco GENxplor R&D for high-precision growth of III-V layers, with composition accuracy error below 1.5%, for heterostructures on substrates up to 3 inches, including GaAs, InP and GaSb.
High-Resolution Patterning
Maskless laser writing is performed using Heidelberg DWL66+ with critical dimension of approximately 800 nm.
Anisotropic Dry Etching
ICP-RIE is performed using Oxford PlasmaPro 100 Cobra for high-precision etching of III-V materials using Cl₂ and BCl₃ chemistries with integrated laser endpointing.
Metallisation and Dielectrics
The service uses
- electron-beam evaporation for high-purity contacts, including Au, Ti, Ni and Pt
- PECVD Oxford PlasmaPro 80 for SiO₂ and Si₃N₄ passivation layers.
Thermal Processing
Rapid thermal annealing is performed using UniTemp RTP-100-HV up to 1200 °C for ohmic contact alloying.
Infrastructure
Processes are performed in integrated cleanroom zones meeting ISO 5 for lithography and ISO 7 for etching.
Target Audience and Possible Clients
The service is intended for
- start-ups validating photonic designs from concept to physical sample
- SMEs accessing advanced III-V processing without high capital investment
- academic institutions requiring high-precision fabrication for R&D projects or collaborative technological experiments.
Service Delivery Mode
The service delivery modes are
- rapid prototyping from GDSII design to physical optoelectronic samples for experimental validation
- training for industry engineers on fabrication equipment operation.
Service Delivery Terms and Times
A mandatory technology testing plan is developed for each client, explicitly defining the scope, timing and technical milestones of the prototyping run.
Possible Restrictions
The facility is optimised for small-batch prototyping and pilot-scale runs. It is not intended for mass or high-volume manufacturing.