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Heterogeneous integration
Prototyping
Chip-to-System Wire Bonding
Heterogeneous Integration
Technical Scope and Capabilities
This service provides automatic chip-to-system connectivity through thermosonic wire bonding for System in package (SiP) applications.
Core Infrastructure / Tools / Equipment
The service uses a TPT HB100 automatic wire bonder with motorized Z-Y-X axes and bond head rotation.
Bonding capabilities:
The service supports interconnections using
- ball bonding
- wedge bonding
- bump bonding
- ribbon bonding.
- gold wire, 25 µm
- aluminium wire, 25 µm
- gold ribbon, 25 × 250 µm.
Operating Parameters:
- Utrasonic power, 0 - 10 Watt
- Bond time, 0 - 5 s
- Bond force, 10 - 200 cN
- Temperature control, up to 200°C (+/-1°C).
Target Audience and Possible Clients
The service is intended for
- start-ups validating advanced interconnect strategies or SiP solutions for photonic or electronic prototypes
- SMEs seeking to explore advanced prototype assemblies without investing in electronic interconnect research
- academic institutions researching compact electronic packaging and SiP interconnect technologies.
Service Delivery Mode
The service delivery modes are
- prototype assemblies for low-volume production and validation
- R&D collaboration in advanced packaging systems and SiP design development
- consulting regarding challenges and limitations.