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Heterogeneous integration
Prototyping
High-Precision Positioning, Bonding and Advanced Packaging
Heterogeneous Integration
Technical Scope and Capabilities
This service supports physical realisation and integration of fabricated chips using high-precision positioning and bonding.
Supported integration techniques include:
- Flip Chip
- FOWLP
- W2W, wafer-to-wafer
- C2W, chip-to-wafer
- 2.5D packaging
- 3D packaging
- MCP, multi-chip package
- MCM, multi-chip module
- CoG
- CoF
- GoG
- FoB
- CoB.
Prototype chips can be finalised by:
- sintering
- soldering
- gluing
- welding
- thermocompression methods
- ultrasonic methods.
Core Infrastructure / Tools / Equipment
The service uses Finetech Sigma equipment.