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Heterogeneous integration
Prototyping
Manual Die Bonding
Heterogeneous Integration
Technical Scope and Capabilities
This service uses a Fineplacer PICO multi-purpose manual die bonder for high-accuracy assembly of semiconductor components.
Capabilities include:
- manual alignment placement accuracy down to 5 micrometres
- placement arm force range of 0.1 N to 20 N
- integrated vacuum chuck heating plate up to 420 °C
- ramp rate of 20 K/s
- placement heads for chips of 0.4 × 2 mm and 0.4 × 3 mm
- handling of specialised laser bars up to 0.4 × 5 × 0.2 mm
- targets up to 40 × 40 mm
- maximum target plus chip thickness of 15 mm.
Target Audience and Possible Clients
The service is intended for
- start-ups validating first-generation prototypes of electronic or photonic modules
- SMEs requiring precision assembly without investment in high-cost equipment
- academic institutions requiring high-precision fabrication for R&D projects or collaborative technological experiments.
Service Delivery Mode
The service delivery modes are
- rapid prototyping from bare dies to assembled and electrically connected modules
- training and specialised guidance on heterogeneous integration techniques and material selection.
Service Delivery Terms and Times
A mandatory technology testing plan is developed for each client, explicitly defining the scope, timing and technical milestones of the prototyping run.
Possible Restrictions
The facility is optimised for small-batch prototyping and research. It is not intended for mass assembly or high-volume manufacturing.