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Chip design
Failure Analysis of Integrated Circuits
Design and Modelling
Technical Scope and Capabilities
This service determines root causes of non-functional or malfunctioning chips using electrical and RF testing methods.
Diagnostics cover:
- signal analysis
- parameter measurements
- functional verification
- parasitic effects
- thermal conditions
- material defects
- process variations.
Expected Outputs
The service provides recommendations for design improvements, manufacturing parameter adjustments or test procedure optimisation.
