Service

Back to service catalogue
Chip design

Chip Testing

Design and Modelling

Reference
4.1.14
Lead partner
VILNIUS TECH

Technical Scope and Capabilities

This service provides testing of bare wafers and packaged integrated circuits. Measurements are performed up to 26 GHz and evaluate electrical parameters and RF characteristics.

Core Infrastructure / Tools / Equipment

The service uses

  • DC test equipment
  • RF test equipment
  • automated measurement systems
  • laboratory infrastructure for measurements up to 26 GHz.

Failure Analysis of Integrated Circuits

CC
VILNIUS TECH
Request this service