{"id":2929,"date":"2025-11-11T12:07:28","date_gmt":"2025-11-11T12:07:28","guid":{"rendered":"https:\/\/chipsc2.lt\/?p=2929"},"modified":"2025-11-11T12:21:26","modified_gmt":"2025-11-11T12:21:26","slug":"microelectronics-2025-from-technology-to-application","status":"publish","type":"post","link":"https:\/\/chipsc2.lt\/lt\/microelectronics-2025-from-technology-to-application\/","title":{"rendered":"MIKROELEKTRONIKA 2025: nuo technologijos iki taikymo"},"content":{"rendered":"<p><strong>Lapkri\u010dio 3\u20134 dienomis Kauno technologijos universitete (KTU) vyko tarptautin\u0117 konferencija \u201eMIKROELEKTRONIKA 2025: nuo technologijos iki taikymo\u201c, sub\u016brusi akademikus, in\u017einierius ir pramon\u0117s specialistus.<\/strong><\/p>\n\n\n\n<p>KTU tarpdisciplininiame prototip\u0173 k\u016brimo laboratorijos centre \u201eM-Lab\u201c dalyviai aptar\u0117 naujausius puslaidininkini\u0173 med\u017eiag\u0173, projektavimo ir integravimo technologij\u0173 pasiekimus.<\/p>\n\n\n\n<p>Konferencij\u0105 atidar\u0117 KTU Elektros ir elektronikos in\u017einerijos fakulteto (EEF) dekanas prof. dr. Mindaugas \u017dilys, pabr\u0117\u017e\u0119s akademin\u0117s bendruomen\u0117s ir pramon\u0117s bendradarbiavimo svarb\u0105. Diskusijas moderavo KTU Technologijos ir fizini\u0173 moksl\u0173 kompetencijos centro (TiFEC) ekspert\u0117 dr. Agata Romanova.<\/p>\n\n\n\n<p>Dviej\u0173 dien\u0173 programoje buvo ne tik pristatymai, bet ir praktiniai seminarai, kuriuos ved\u0117 tarptautiniai mikroelektronikos projektavimo ir atvirojo kodo puslaidininki\u0173 k\u016brimo ekspertai, \u012fskaitant IHP \u2013 Leibnico inovatyvios mikroelektronikos instituto ir Vokietijos tiksliosios \u012frangos gamintojos \u201eFinetech\u201c atstovus.<\/p>\n\n\n\n<p>Pagrindinis prane\u0161\u0117jas, IHP \u201eOpenPDK\u201c konsultantas dr. Wladek Grabinski, aptar\u0117 atvirojo kodo projektavimo procesus ir IHP 130 nm BiCMOS technologijos naudojim\u0105. Leo Moser ir Matthias Koeferlein pristat\u0117 \u201eLibreLane\u201c ir \u201eKLayout\u201c \u012frankius lust\u0173 projektavimui ir i\u0161d\u0117stymui, o Holger Voigt, Stefan Frederik Schippers ir dr. Philip Ostrovskyy (IHP) pristat\u0117 NGSPICE ir \u201eXschem\u201c technologij\u0173 naudojim\u0105 analoginiam ir mi\u0161ri\u0173 signal\u0173 modeliavimui.<\/p>\n\n\n\n<p>Elektronikos in\u017einerijos katedros prof. Dangirutis Navikas savo prane\u0161ime \u201eNetiesini\u0173 keramini\u0173 kondensatori\u0173 naudojimo vidutin\u0117s \u012ftampos talpiniuose dalikliuose i\u0161\u0161\u016bkiai\u201c pasidalijo naujausiais TiFEC tyrim\u0173 rezultatais.<\/p>\n\n\n\n<p>Antroji konferencijos diena buvo skirta praktiniams mokymams. Leonie Dobis, \u201eFinetech\u201c taikom\u0173j\u0173 program\u0173 in\u017einier\u0117, kartu su savo komanda pristat\u0117 2.0, 2.5 ir 3D hibridini\u0173 lust\u0173 sistem\u0173 technologijas ir ved\u0117 praktinius seminarus, skirtus praktiniam lust\u0173 pakavimo proces\u0173 ir technologij\u0173 mokymuisi.<\/p>\n\n\n\n<p>Tuo pa\u010diu metu KTU Lust\u0173 projektavimo akademijos dalyviai \u012fgijo praktin\u0117s patirties su atvirojo kodo lust\u0173 projektavimo ir modeliavimo \u012frankiais, naudodami IHP OpenPDK modulius.<\/p>\n\n\n\n<p>Tiek pramon\u0117s, tiek akademin\u0117s bendruomen\u0117s atstovai i\u0161rei\u0161k\u0117 pasitenkinim\u0105, kad \u0161i EEF organizuota konferencija tapo nacionaline platforma partneryst\u0117ms stiprinti, profesin\u0117ms kompetencijoms tobulinti ir dalintis patirtimi.<\/p>\n\n\n\n<p>Svarbu tai, kad \u0161is renginys reik\u0161mingai prisid\u0117jo prie Lietuvos puslaidininki\u0173 kompetencij\u0173 ekosistemos augimo, kuri\u0105 pl\u0117toja \u201eChipsC2-LT\u201c kompetencij\u0173 centras \u2013 svarbi nacionalin\u0117 iniciatyva, skatinanti bendradarbiavim\u0105, inovacijas ir \u012fg\u016bd\u017eius puslaidininki\u0173 technologij\u0173 srityje. KTU atlieka neatsiejam\u0105 vaidmen\u012f \u201eChipsC2-LT\u201c veikloje, aktyviai remdamas Lietuvos strategin\u0119 pa\u017eang\u0105 Europos mikroelektronikos srityje.<\/p>\n\n\n\n<p><\/p>","protected":false},"excerpt":{"rendered":"<p>On November 3\u20134, the international conference \u201cMICROELECTRONICS 2025: From Technology to Application\u201d took place at Kaunas University of Technology (KTU), bringing together academics, engineers, and industry professionals. At KTU\u2019s interdisciplinary [&hellip;]<\/p>\n","protected":false},"author":5,"featured_media":2933,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"default","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"_price":"","_stock":"","_tribe_ticket_header":"","_tribe_default_ticket_provider":"","_tribe_ticket_capacity":"0","_ticket_start_date":"","_ticket_end_date":"","_tribe_ticket_show_description":"","_tribe_ticket_show_not_going":false,"_tribe_ticket_use_global_stock":"","_tribe_ticket_global_stock_level":"","_global_stock_mode":"","_global_stock_cap":"","_tribe_rsvp_for_event":"","_tribe_ticket_going_count":"","_tribe_ticket_not_going_count":"","_tribe_tickets_list":"[]","_tribe_ticket_has_attendee_info_fields":false,"footnotes":""},"categories":[8],"tags":[72,74,73],"class_list":["post-2929","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-chipsc2-lt","tag-innovation-in-lithuania","tag-semiconductor-ecosystem"],"_links":{"self":[{"href":"https:\/\/chipsc2.lt\/lt\/wp-json\/wp\/v2\/posts\/2929","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/chipsc2.lt\/lt\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/chipsc2.lt\/lt\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/chipsc2.lt\/lt\/wp-json\/wp\/v2\/users\/5"}],"replies":[{"embeddable":true,"href":"https:\/\/chipsc2.lt\/lt\/wp-json\/wp\/v2\/comments?post=2929"}],"version-history":[{"count":2,"href":"https:\/\/chipsc2.lt\/lt\/wp-json\/wp\/v2\/posts\/2929\/revisions"}],"predecessor-version":[{"id":2932,"href":"https:\/\/chipsc2.lt\/lt\/wp-json\/wp\/v2\/posts\/2929\/revisions\/2932"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/chipsc2.lt\/lt\/wp-json\/wp\/v2\/media\/2933"}],"wp:attachment":[{"href":"https:\/\/chipsc2.lt\/lt\/wp-json\/wp\/v2\/media?parent=2929"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/chipsc2.lt\/lt\/wp-json\/wp\/v2\/categories?post=2929"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/chipsc2.lt\/lt\/wp-json\/wp\/v2\/tags?post=2929"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}