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X-WR-CALNAME:Chips Competence Centre - Lithuania
X-ORIGINAL-URL:https://chipsc2.lt/lt
X-WR-CALDESC:Chips Competence Centre - Lithuania renginiai
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BEGIN:VTIMEZONE
TZID:UTC
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TZNAME:UTC
DTSTART:20240101T000000
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BEGIN:VEVENT
DTSTART;TZID=UTC:20251006T080000
DTEND;TZID=UTC:20251006T170000
DTSTAMP:20260424T140211
CREATED:20251002T083335Z
LAST-MODIFIED:20251006T083856Z
UID:2896-1759737600-1759770000@chipsc2.lt
SUMMARY:Baltic and Finnish Chips Competence Centers Join Forces for Stronger Semiconductor Future
DESCRIPTION:On October 2nd\, Latvia hosted a key regional event bringing together Lithuanian Chips Competence Center (ChipsC2-LT)\, Latvian Chip Competence Centre (LCCC)\, Estonian Chip Technology Competence Center\, Finnish Chips Competence Centre (FiCCC)\, strengthening cooperation in the framework of the European Chips Act and paving the way for joint initiatives. \nDuring the event\, each national Chips Competence Center presented its activities\, highlighting unique expertise and contributions to the European chips value chain. The discussions showcased how the Baltic-Finland region can position itself as important player in Europe’s technological sovereignty. \nThe interactive workshops focused on five working groups: \nOperations and Best Practices – sharing management models and successful approaches. \nOutreach and Events – exploring opportunities for joint communication\, public awareness\, and international presence. \nCommon Technology Offers – mapping technological services that can be provided jointly to industry and research. \nTraining and Skills Development – addressing the need for highly skilled professionals and open-access training. \nFinance – discussing sustainable funding models. \nThe participants agreed that collaboration across the Baltic and Finnish chips competence centers is crucial for building a strong\, resilient\, and innovative semiconductor ecosystem. Joint actions – from public outreach to technology offers – will ensure better visibility\, attract investments\, and foster skills needed for Europe’s chip industry. \nThis meeting was an important step in uniting our Baltic-Finland regional strengths. By working together\, we can amplify our impact and ensure that the Baltic-Finland region is firmly on the map of Europe’s chips future. \nThe event concluded with a shared commitment to prepare joint initiatives\, including international events\, training activities\, and collaborative technology offers\, reinforcing the region’s role in Europe’s digital transformation.
URL:https://chipsc2.lt/lt/event/baltic-and-finnish-chips-competence-centers-join-forces-for-stronger-semiconductor-future/
CATEGORIES:Workshop
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BEGIN:VEVENT
DTSTART;TZID=UTC:20251014T080000
DTEND;TZID=UTC:20251014T170000
DTSTAMP:20260424T140211
CREATED:20251014T140709Z
LAST-MODIFIED:20251014T140709Z
UID:2912-1760428800-1760461200@chipsc2.lt
SUMMARY:Can Lasers Help Reinvigorate Lithuania’s Semiconductor Industry?
DESCRIPTION:At the 46th National Physics Conference (LNFk-46)\, held in Kaunas University of  Technology (KTU) on October 9–10\, one of the plenary session presentations focused on the future of semiconductor technologies in Lithuania. Dr. Gediminas Račiukaitis\,  coordinator of the ChipsC2-LT project\, delivered a talk entitled “Can Lasers Help Reinvigorate Lithuania’s Semiconductor Industry?” The presentation addressed the objectives of the European Union’s Chips Act\, Lithuania’s role within the broader semiconductor ecosystem\, and how laser technologies could serve as a cornerstone for restoring and strengthening the country’s microelectronics potential. \nDr. G. Račiukaitis emphasized that the Lithuanian Chips Competence Centre (ChipsC2-LT)\, operating as a “one-stop-shop” platform\, aims to connect science and industry—from microchip design to advanced packaging technologies. The project\, funded under the European Chips Joint Undertaking (Chips JU)\, involves four main partners: FTMC\, Vilnius University\, Vilnius TECH\, and Kaunas University of Technology (KTU). It represents Lithuania’s contribution to the European semiconductor network\, which unites more than 30 competence centers across the continent. During the presentation\, several areas were highlighted in which Lithuania already holds high added value:\n· Laser technologies for advanced semiconductor packaging\,\n· Heterogeneous integration and microchip interconnection solutions\,\n· III–V compound and THz technology research\,\n· GaN (Gallium Nitride) Materials\n· Chip Design and RF Circuits\n· ASIC and MEMS Technologies\n· Close collaboration with Taiwan’s Ultra-Fast Laser Technology Center (ULTRI). \nIn conclusion\, Dr. G. Račiukaitis noted that the European Chips Act still requires improvement to genuinely stimulate innovation and investment across Europe. However\, projects like ChipsC2-LT demonstrate that regional collaboration can become a driving force toward technological independence. “Lasers are not only our strength but also an opportunity to reignite the revival of Lithuania’s semiconductor industry\,” -said Dr. G. Račiukaitis. \nMore information about this event: https://lnfk.ktu.edu/ \n 
URL:https://chipsc2.lt/lt/event/can-lasers-help-reinvigorate-lithuanias-semiconductor-industry/
CATEGORIES:Conference
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END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20251212
DTEND;VALUE=DATE:20251213
DTSTAMP:20260424T140211
CREATED:20251113T145407Z
LAST-MODIFIED:20251114T072830Z
UID:2942-1765497600-1765583999@chipsc2.lt
SUMMARY:Baltic PCB & Systems Conference
DESCRIPTION:Baltic PCB & Systems Conference is a technical event created by engineers for engineers. After the success of Vilnius PCB Day with more than 80 participants\, we are expanding the scope to cover the full board-level lifecycle: design\, simulations\, manufacturing\, assembly\, RF\, EMC\, and certification. \nWe connect PCB designers\, hardware engineers\, manufacturers\, and technology leaders from the Baltic region and beyond. Together\, we share practical experience\, discuss real design challenges\, and explore solutions that help bring reliable electronics to market. \nThe program includes expert presentations\, SI/PI and RF insights\, DFM best practices\, hands-on demos of advanced tools\, and networking with peers and partners. \nChipsC²-LT Competence Centre\, one of the key organizers of the conference\, plays a central role in creating and strengthening Lithuania’s semiconductor ecosystem. With world-class infrastructure\, expert consulting\, and direct access to the European semiconductor ecosystem through the ENCCC network\, ChipsC²-LT links Lithuanian companies to over 30 competence centres across Europe\, driving innovation and collaboration in board-level electronics. \nJoin the Baltic PCB & Systems Conference to stay up to date with innovations in board-level electronics\, expand your professional network\, and be part of Lithuania’s gateway to European semiconductor excellence. \nMore information: Baltic PCB & Systems Conference
URL:https://chipsc2.lt/lt/event/baltic-pcb-systems-conference/
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20260309
DTEND;VALUE=DATE:20260310
DTSTAMP:20260424T140211
CREATED:20260220T062448Z
LAST-MODIFIED:20260220T062448Z
UID:3348-1773014400-1773100799@chipsc2.lt
SUMMARY:Invitation to Attend the FAMES Pilot Line “2026 Open-Access Call” Event
DESCRIPTION:FAMES Pilot Line invites chipmakers\, startups\, fabless companies\, members of the academic community\, and representatives of Research and Technology Organizations (RTOs) to participate in the “2026 Open-Access Call” launch  workshop. \nDuring the event\, advanced semiconductor technologies currently available to industry and research institutions will be presented. Participants will also receive detailed guidance on how to take advantage of the open-access opportunities. \nEvent details: \n\nDate: March 9\, 2026\nTime: 14:00–16:30 (CET)\nFormat: Online event\nMore information and registration: https://h1.nu/1p9S8\n\nThe Open-Access programme provides access to advanced technologies\, including FD-SOI\, embedded non-volatile memories\, 3D integration\, RF components\, and power management solutions. These opportunities are particularly relevant for chip design companies\, university researchers\, PhD and research groups working in microelectronics\, semiconductor technologies\, and related fields. \nWe invite to participate in the event and take advantage of the opportunity to expand international cooperation\, thereby contributing to the strengthening of the European semiconductor ecosystem.
URL:https://chipsc2.lt/lt/event/invitation-to-attend-the-fames-pilot-line-2026-open-access-call-event/
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END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260423
DTEND;VALUE=DATE:20260425
DTSTAMP:20260424T140211
CREATED:20251205T083937Z
LAST-MODIFIED:20251208T110756Z
UID:3017-1776902400-1777075199@chipsc2.lt
SUMMARY:We Invite You to Participate in the International Conference eStream 2026
DESCRIPTION:The Faculty of Electronics at Vilnius Gediminas Technical University (VILNIUS TECH) cordially invites researchers\, doctoral students\, members of the academic community\, and industry professionals to submit papers and participate in the 13th International Conference on Electrical\, Electronic and Information Sciences – eStream 2026. \nConference Dates: April 23–24\, 2026\nVenue: VILNIUS TECH Faculty of Electronics\, Plytinės St. 25\, Vilnius\, Lithuania\nParticipation: In-person only \nAbout the Conference \nThe aim of eStream 2026 is to bring together both advanced and early-stage researchers\, as well as engineering professionals\, to share the latest research findings and ideas in the fields of electrical\, electronic engineering\, and information sciences. \nThis year\, the conference will place special emphasis on semiconductor technologies. The event is supported by the Lithuanian Chips Competence Center (ChipsC²-LT) – a national project\, supported by the CHIPS for Europe Initiative\, aimed at strengthening Lithuania’s integration into Europe’s semiconductor ecosystem. ChipsC²-LT provides expertise\, infrastructure\, and services to accelerate innovation\, research\, and growth of the semiconductor industry in Lithuania. \nParticipants interested in the latest developments in semiconductors\, microelectronics\, and integrated circuit technologies are encouraged to submit papers and join the community being developed by ChipsC²-LT\, thereby contributing to the growth of the European semiconductor ecosystem. \nConference Topics (including\, but not limited to): \n\nElectronics for defense and dual-use technologies\nCommunication\, networking\, and broadcast technologies\nElectronic components\, circuits\, devices\, and systems\nComputing and data processing\nElectromagnetic phenomena and radio wave propagation\nElectrical power and energy storage applications\nRobotics and control systems\nSignal processing and analysis\n\nAccepted papers will be submitted for publication in the IEEE Xplore digital library. \nImportant Dates \n\nAbstract Submission Deadline: February 15\, 2026\nPoster Proposal Submission Deadline: March 1\, 2026\nNotification of Acceptance: March 15\, 2026\nFinal Paper Submission: April 15\, 2026\n\nRegistration and Information \nFor more details and registration\, please visit http://vilniustech.lt/estream \nJoin the Scientific Committee \nThe conference invites new members to join the Scientific Committee (CSC/TPC). If you would like to contribute by reviewing 2–3 papers\, please contact us at estream@vilniustech.lt \nWe look forward to welcoming you in Vilnius in April 2026! \n 
URL:https://chipsc2.lt/lt/event/we-invite-you-to-participate-in-the-international-conference-estream-202/
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